Qseven™ Form Factor module with ARM's powerful Cortex-A8 core OMAP 3530 offers multimedia performance and handheld power.
SECO® presents the QUADMO747-X/OMAP module – based on the Texas Instruments™ OMAP 35x Family ARM® Cortex™ A8 core.
Nürnberg, Embedded World 2010, 2nd to 4th March, 2010: Today SECO® unveiled its first module based Texas Instruments™ OMAP 35x Family ARM® Cortex™ A8 core.
Mounted in a Qseven™ form factor this module is targeting low-power embedded and commercial applications, providing a rich set of multimedia, connectivity and storage capability.
Designed for easy integration into embedded application the small size and low power consumption of the QUADMO747-X/OMAP allows its integration into hand-held and mobile devices, while its low price makes it an ideal selection for cost-sensitive applications.
The SECO® QUADMO747-X/OMAP enrich the range of SECO Qseven™ form factor solutions:
- The Texas Instruments ™ OMAP™ integrated on the module is the 3530 that operates at speeds up to 720 MHz and can be down clocked at 600MHz. This ARM® Cortex™ A8 core combined with 520MHz TMS320C64x+ DSP features faster access to databases, spreadsheets, email, audio, video, and other content and POWERVR SGX™ for 3D graphics Accelerator.
- SECO® QUADMO747-X/OMAP will also feature up to 512MB DRAM on board, Flash Disk up to 1 GB, SM bus, 3 USB OTG and Host ports, 3x MMC/SDI/O channels, ETH, LPC, LVDS Single or Dual Channel 18/24 bit, HD Audio.
- SECO® will provide boot loader BOARD SUPPORT PACKAGE (BSP) and API Pack that allow the user to run immediately the module with a OS.
SECO® QUADMO747-X/OMAP is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: streaming video, 3D mobile gaming, video conferencing, high-resolution still image. The module will support high-level operating systems (OSs), such are Linux and Windows CE allowing the user to move from a x 86 architecture to the RISC without change form factor or carrier. This is possible thanks to the connection between the module and the input-output ports present on the carrier where a standard pin out has been defined.